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Creep Buckling Analyses of Circular Cylindrical Shells Under Axial Compression—Bifurcation Buckling Analysis by the Finite Element Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The finite element method is applied to the creep buckling of circular cylindrical shells under axial compression. Not only the axisymmetric mode but also the bifurcation mode of the creep ...
Analytical Studies of Blowdown Thrust Force and Elastic-Plastic Behavior of Pipe at Pipe Rupture Accident
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: When high-temperature and high-pressure water is ejected from pipe, a blowdown thrust force will act on the pipe and it will cause pipe movement. The analytical methods of blowdown thrust force ...
Bifurcation Buckling of Circular Cylindrical Shells Subjected to Axial Compression During Creep Deformation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the present work, analytical and experimental investigations were performed on creep buckling. Special attention was focussed on bifurcation behavior during creep deformation. The finite element ...
Evaluation and Prediction of Critical Overhang Length Under Pipe Whip Accident
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: When the pipe length between break exit and restraint is long in the pipe whip accident, the pipe will undergo a plastic collapse as the moment increases. The length at which plastic collapse ...
Creep Buckling Under Varying Loads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Creep buckling analyses under stepwise varying loads are performed on a circular cylindrical shell with initial imperfection subjected to axial compression and a partial spherical shell under ...
Constraint Effects of Clad on Underclad Crack
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The finite element method is applied to two-dimensional elastic-plastic analyses for underclad crack problems. The analyses are performed for rectangular specimens with an underclad crack, which ...
Failure Estimation of Semiconductor Chip During Wire Bonding Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wire bonding, a process of the connection between a semiconductor chip and a lead frame by a thin metal wire, is one of the important processes of electronic packaging. This paper presents ...
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