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RISHigh Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes the development and characterization of anisotropically conductive films (ACFs) incorporated with copper (Cu) particles as electrically conductive fillers for environmentally ...
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling ...