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    Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004:;page 41012-1
    Author(s): Saito, Daiki; Sasagawa, Kazuhiko; Moriwaki, Takeshi; Fujisaki, Kazuhiro
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Printed electronics (PEs) have attracted attention for the fabrication of microscale electronic circuits. PEs use conductive inks which include metal nanoparticles. The conductive ink can be printed on flexible substrates ...
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    Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
    Author(s): Saito, Daiki; Sasagawa, Kazuhiko; Moriwaki, Takeshi; Fujisaki, Kazuhiro
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Flexible printed circuits (FPCs) are widely used in electronic equipment such as mobile devices and wearable sensors. The conductive electric lines in these circuits are printed using nanoparticle metal ink and ink-jet ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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