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RISParametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work is a numerical study of microfluidic cooling of integrated circuits (ICs), using embedded micropin-fins on a silicon chip. The study considers non-uniform chip heat fluxes (250–500 W/cm2) and variable pin fin ...