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    Effects of Pressure and a Microporous Coating on HFC 245fa Pool Boiling Heat Transfer 

    Source: Journal of Heat Transfer:;2014:;volume( 136 ):;issue: 010:;page 101502
    Author(s): Moreno, Gilberto; Jeffers, Jana R.; Narumanchi, Sreekant
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A study was conducted to experimentally characterize the pool boiling performance of hydrofluorocarbon HFC245fa at pressures ranging from 0.15 MPa to 1.1 MPa (reduced pressure range: 0.04–0.31). Pool boiling experiments ...
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    Pool Boiling Heat Transfer Characteristics of HFO 1234yf on Plain and Microporous Enhanced Surfaces 

    Source: Journal of Heat Transfer:;2013:;volume( 135 ):;issue: 011:;page 111014
    Author(s): Moreno, Gilberto; Narumanchi, Sreekant; King, Charles
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study characterizes the pool boiling performance of HFO1234yf (hydrofluoroolefin 2,3,3,3tetrafluoropropene). HFO1234yf is a new, environmentally friendly refrigerant likely to replace HFC134a in automotive airconditioning ...
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    Microstructured Surfaces for Single Phase Jet Impingement Heat Transfer Enhancement 

    Source: Journal of Thermal Science and Engineering Applications:;2013:;volume( 005 ):;issue: 003:;page 31004
    Author(s): Moreno, Gilberto; Narumanchi, Sreekant; Venson, Travis; Bennion, Kevin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental investigation was conducted to examine the use of microstructured surfaces to enhance jet impingement heat transfer. Three microstructured surfaces were evaluated: a microfinned surface, a microporous ...
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    Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink 

    Source: Journal of Electronic Packaging:;2023:;volume( 146 ):;issue: 002:;page 21007-1
    Author(s): Osman, Ammar; Moreno, Gilberto; Myers, Steve; Major, Joshua; Feng, Xuhui; Narumanchi, Sreekant V. J.; Joshi, Yogendra
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The next generation of integrated power electronics packages will implement wide-bandgap devices with ultrahigh device heat fluxes. Although jet impingement has received attention for power electronics thermal management, ...
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