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Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ...
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The data center's server power density and heat generation have increased exponentially because of the recent, unparalleled rise in the processing and storing of massive amounts of data on a regular basis. One-third of the ...