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    Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41117-1
    Author(s): Shahi, Pardeep; Heydari, Ali; Eslami, Bahareh; Radmard, Vahideh; Hinge, Chandraprakash; Modi, Himanshu; Chinthaparthy, Lochan Sai Reddy; Tradat, Mohammad; Agonafer, Dereje; Rodriguez, Jeremy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ...
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    Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41112-1
    Author(s): Bansode, Pratik; Suthar, Rohit; Bhandari, Rabin; Lakshminarayana, Akshay; Eda, Naga Tejesh; Gupta, Gautam; Simon, Vibin; Modi, Himanshu; Nair, Vivek; Shahi, Pardeep; Saini, Satyam; Sivaraju, Krishna Bhavana; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The data center's server power density and heat generation have increased exponentially because of the recent, unparalleled rise in the processing and storing of massive amounts of data on a regular basis. One-third of the ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian