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    Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 001:;page 011011-1
    Author(s): Misrak, Abel; Chauhan, Tushar; Rajmane, Pavan; Bhandari, Rabin; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal interface materials (TIMs) are an important component in electronic packaging, and there is a concerted effort to understand their reliability when used under various environmental load conditions. Previous researchers ...
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    Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003:;page 31003
    Author(s): Shah, Jimil M.; Misrak, Abel; Agonafer, Dereje; Kaler, Mike
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: Contamination due to the use of airside economizer has become a major issue that cost companies revenue. This issue will continue to rise as server components become smaller, densely packed, and as companies move into more ...
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