Search
CSV
RISAnalysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An average Reynolds equation considering the effects of a pad’s annular grooves and surface roughness is developed in this study to examine mixed lubrication in the chemical mechanical polishing ...
Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the chemical mechanical planarization of a copper-film silicon wafer, the average Reynolds equation with flow factors has also been developed for a cylindrical coordinate system to study the ...