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    Correlating Microscale Thermal Conductivity of Heavily-Doped Silicon With Simultaneous Measurements of Stress 

    Source: Journal of Engineering Materials and Technology:;2011:;volume( 133 ):;issue: 004:;page 41013
    Author(s): Ming Gan; Vikas Tomar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The functioning and performance of today’s integrated circuits and sensors are highly affected by the thermal properties of microscale silicon structures. Due to the well known size effect, the ...
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