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    Local Heat Transfer Characteristics in Simulated Electronic Modules 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003:;page 362
    Author(s): Seong-Yeon Yoo; Jong-Hark Park; Min-Ho Chung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: When heat is released by forced convection from electronic modules in a narrow printed circuit board channel, complex flow phenomena—such as stagnation and acceleration on the front surface, ...
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