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    A Review on Laser Processing in Electronic and MEMS Packaging 

    Source: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003:;page 30801
    Author(s): Rahim, Kaysar; Mian, Ahsan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical ...
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    Biomechanical Analysis of a Filiform Mechanosensory Hair Socket of Crickets 

    Source: Journal of Biomechanical Engineering:;2016:;volume( 138 ):;issue: 008:;page 81006
    Author(s): Joshi, Kanishka; Mian, Ahsan; Miller, John
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Filiform mechanosensory hairs of crickets are of great interest to engineers because of the hairs' highly sensitive response to lowvelocity aircurrents. In this study, we analyze the biomechanical properties of filiform ...
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    A Numerical Study of Diffusion of Nanoparticles in a Viscous Medium During Solidification 

    Source: Journal of Thermal Science and Engineering Applications:;2019:;volume( 011 ):;issue: 001:;page 11013
    Author(s): Rahman, Kazi M.; Ruhul Amin, M.; Mian, Ahsan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the field of additive manufacturing process, laser cladding is widely considered due to its cost effectiveness, small localized heat generation, and full fusion to metals. Introducing nanoparticles with cladding metals ...
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    Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications 

    Source: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 002:;page 20904
    Author(s): Snigdha Tummala, Vana; Mian, Ahsan; Chamok, Nowrin H.; Poduval, Dhruva; Ali, Mohammod; Clifford, Jallisa; Majumdar, Prasun
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Engineered porous structures are being used in many applications including aerospace, electronics, biomedical, and others. The objective of this paper is to study the effect of three-dimensional (3D)-printed porous ...
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