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Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a ...
Product-Oriented Sensitivity Analysis for Multistation Compliant Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Dimensional variation in assembled products directly affects product performance. To reduce dimensional variation, it is necessary that an assembly be robust. A robust assembly is less sensitive ...
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