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Materials Processing Defects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The papers in this special edition came from lectures delivered at the Fifth International Conference on Materials Processing Defects (MPD-5) held at Cornell University July 18–20, 2007 at Cornell ...
Quantitative Stress Analysis of Recrystallized OFHC Cu Subject to Deformation In Situ
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Quantitative strain analysis (QSA) provides a means for assessing the orientation-dependent micromechanical stress states in bulk polycrystalline materials. When combined with quantitative texture ...
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