Abstract: Thermal interface materials (TIMs) play a critical role in conventionally packaged electronic systems and often represent the highest thermal resistance and/or least reliable element in the heat flow path from the chip to ...

Abstract: Defense Advanced Research Project Agency's (DARPA's) thermal ground plane (TGP) effort was aimed at combining the advantages of vapor chambers or twodimensional (2D) heat pipes and solid conductors by building thin, high ...