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    A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001:;page 71
    Author(s): Tadahiro Shibutani; Qiang Yu; Masaki Shiratori
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As the shrinkage and integration of devices, the creep behavior of tin-based alloys becomes important with microscales. In this paper, the behavior of creep deformation in solder alloys during ...
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    Failure Behavior of Piping Systems With Wall Thinning Under Seismic Loading 

    Source: Journal of Pressure Vessel Technology:;2004:;volume( 126 ):;issue: 001:;page 85
    Author(s): Izumi Nakamura; Akihito Otani; Masaki Shiratori
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Shaking table tests of three-dimensional piping models with degradation were conducted in order to investigate the influence of degradation on dynamic behavior and failure modes of piping systems. ...
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    Comparison of Failure Modes of Piping Systems With Wall Thinning Subjected to In-Plane, Out-of-Plane, and Mixed Mode Bending Under Seismic Load: An Experimental Approach 

    Source: Journal of Pressure Vessel Technology:;2010:;volume( 132 ):;issue: 003:;page 31001
    Author(s): Izumi Nakamura; Akihito Otani; Masaki Shiratori
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Pressurized piping systems used for an extended period may develop degradations such as wall thinning or cracks due to aging. It is important to estimate the effects of degradation on the ...
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    Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis 

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003:;page 31012
    Author(s): Takashi Anzawa; Masanori Yamagiwa; Tadahiro Shibutani; Masaki Shiratori; Qiang Yu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents a simulation method to evaluate the thermal fatigue life of a power module. A coupled electrical-thermal analysis was performed to obtain the nonuniform temperature distribution ...
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