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A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As the shrinkage and integration of devices, the creep behavior of tin-based alloys becomes important with microscales. In this paper, the behavior of creep deformation in solder alloys during ...
Failure Behavior of Piping Systems With Wall Thinning Under Seismic Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Shaking table tests of three-dimensional piping models with degradation were conducted in order to investigate the influence of degradation on dynamic behavior and failure modes of piping systems. ...
Comparison of Failure Modes of Piping Systems With Wall Thinning Subjected to In-Plane, Out-of-Plane, and Mixed Mode Bending Under Seismic Load: An Experimental Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Pressurized piping systems used for an extended period may develop degradations such as wall thinning or cracks due to aging. It is important to estimate the effects of degradation on the ...
Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a simulation method to evaluate the thermal fatigue life of a power module. A coupled electrical-thermal analysis was performed to obtain the nonuniform temperature distribution ...
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