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    Air Flow and Heat Transfer in Fan Cooled Electronic Systems 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001:;page 124
    Author(s): Ronan Grimes; Mark Davies
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, measurements of surface temperature and air velocity are presented for the case of a printed circuit board with heated metal elements in a fan-induced flow. Surface temperature ...
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    A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 004:;page 480
    Author(s): Reena Cole; Mark Davies; Jeff Punch
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests, measuring a thermal resistance value for a single component on a standard ...
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