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RISThermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter1
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the European project BRAINE, an extremely efficient passive thermosyphon cooling system was developed for a novel type of Edge MicroDataCenter (EMDC) with high heat fluxes to dissipate on individual computer cards and ...
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study is focused on the experimental characterization of two-phase heat transfer performance and pressure drops within an ultracompact heat exchanger (UCHE) suitable for electronics cooling applications. In this ...
Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio (FR) can however ...