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Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed ...
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly ...
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, Although, both are centrifugal blowers. The blade design ...
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