Abstract: Conformally integrating conductive circuits with rigid 3D surfaces is a key need for smart materials and structures. This paper investigates sequential thermoforming and flash light sintering (FLS) of conductive silver ...

Abstract: Conformally integrating conductive circuits with rigid 3D surfaces is a key need for smart materials and structures. This paper investigates sequential thermoforming and flash light sintering (FLS) of conductive silver ...

Abstract: Incremental forming of thermoplastic surfaces has recently received significant interest due to the potential for simultaneous reduction in thermal energy consumption and in part-shape specific tooling. This paper examines ...

Abstract: Advanced manufacturing processes are often based on complex multiphysics phenomena that are either poorly understood or are computationally too expensive to simulate in the context of process design, control, or planning. ...

Abstract: Microtexturing of surfaces has various applications that often involve texturing over large (macroscale) areas with high precision and resolution. This demands scalability and speed of texturing while retaining feature ...

Abstract: Incremental forming (IF) is a relatively new technique that uses a simple hemispherical ended tool moving along a predefined threedimensional toolpath to deform a sheet of metal into the desired shape. The greater process ...

Abstract: Doublesided incremental forming (DSIF) is a relatively new dieless forming process which uses two hemispherical ended tools, one on each side of the sheet, moving along a predefined trajectory to locally deform a peripherally ...