Abstract: Ohmic curing was utilized as a method to improve the conductivity of threedimensional (3D) interconnects printed from silverloaded conductive inks and pastes. The goal was to increase conductivity of the conductive path ...

Abstract: This research focused on extending the applications of fused deposition modeling (FDM) by extrusion and deposition of low melting temperature metal alloys to create threedimensional metal structures and singlelayer contacts ...

Abstract: To build multimaterial objects using additive manufacturing (AM), modifications to the majority of current conventional AM processes are required. Typically, deposition can only occur on flat surfaces and motion requires ...