Abstract: Thermal loads during the production and service process of power semiconductor devices can induce significant stress on interconnects, potentially leading to the fracture and even the ultimate failure of the devices. ...

Abstract: The emerging skin-integrated devices have been embedded with various functions, whose ideal implementation typically relies on intact bonding to curved substrates. However, the predeformation, which originates from the ...

Abstract: A system has been developed to measure the threedimensional weld pool surface geometry in the gas metal arc welding (GMAW) process. It utilizes the specular nature of the weld pool surface by projecting a fiveline laser ...

Abstract: We study the bending stiffness of symmetrically bent circular multilayer van der Waals (vdW) material sheets, which correspond to the nonisometric configuration in bulge tests. Frenkel sinusoidal function is employed to ...

Abstract: We consider how the bending stiffness of a multilayer graphene sheet relies on its bending geometry, including the in-plane length L and the curvature κ. We use an interlayer shear model to characterize the periodic ...