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    Effect of Surface Asperity on Interfacial Contact Process Controlled by Power Law Creep—Numerical Study of Viscoplastic Adhering Process 

    Source: Journal of Engineering Materials and Technology:;1995:;volume( 117 ):;issue: 003:;page 330
    Author(s): Y. Takahashi; M. Tanimoto
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An interfacial contact process due to power law creep is studied using a finite element technique. The contact process is assumed to be produced by power law creep alone after initial intimate ...
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    Experimental Study of Interfacial Contacting Process Controlled by Power Law Creep 

    Source: Journal of Engineering Materials and Technology:;1995:;volume( 117 ):;issue: 003:;page 336
    Author(s): Y. Takahashi; M. Tanimoto
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Interfacial contacting processes under a high temperature and a high bonding pressure (T = 973 K, P = 30 MPa) are experimentally studied, using oxygen free copper. The faying surfaces were ...
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