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RISEmbedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate ...