Abstract: The application of underfill materials to fill up the room between the chip and substrate is known to substantially improve the thermal fatigue life of flip chip solder joints. Nowadays, no-flow ...

Abstract: Sn-based, Pb-free solders with high a Sn content and high melting temperature often cause excessive interfacial reactions at interfaces. Sn-3.5Ag solder alloy has been used to identify its ...