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    Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002:;page 147
    Author(s): M. K. Shah
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The purpose of this study was to evaluate parameters such as solder joint standoff and fillet heights, termination cap length, chip eccentricity, chip rotation, etc. that influence stresses in ...
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    PIV Study of Turbulent Flow in Asymmetric Converging and Diverging Channels 

    Source: Journal of Fluids Engineering:;2008:;volume( 130 ):;issue: 001:;page 11204
    Author(s): M. K. Shah; M. F. Tachie
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental investigation of turbulent flow subjected to variable adverse and favorable pressure gradients in two-dimensional asymmetric channels is reported. The floors of the diverging and ...
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