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Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The Low Temperature Transient Liquid Phase Diffusion Bonding (LTTLP) process has been used to reduce the residual stresses and hence, improve the thermal fatigue performance of bonds between ...
Normal Form and Luenberger Observer for Linear Mechanical Descriptor Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Normal forms are presented for linear mechanical systems with holonomic and/or nonholonomic constraints. These forms provide deep insight into the peculiar system structure of constrained linear ...
On Luenberger Observer Design for Constrained Mechanical Systems
Publisher: The American Society of Mechanical Engineers (ASME)