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RISTwo-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Increased rate of heat dissipation from electronic chips was explored by the application of flow boiling in mini-channel (D = 2.54 mm) and micro-channel (D = 510 μm) heat sinks with special ...