Abstract: In this paper, the vibration durability of both SAC305 and Sn37Pb interconnects are investigated with narrow-band harmonic vibration tests conducted at the first natural frequency of the test, ...

Abstract: The development of portable electronics poses design challenges when evolving new designs for high strain-rate life cycle loading, such as in drop events, blast events, vibration, ultrasonic ...

Abstract: In this study, the transient response of electronic assemblies to mechanical loading encountered in drop and shock conditions are investigated with transient finite element methods. Many manufacturers ...