Abstract: We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding ...

Abstract: During normal power cycling of the electronic equipment, the differing coefficients of thermal expansion result in differential elongations. Because each level of packaging is subject to mounting ...

Abstract: Fully developed laminar flow heat transfer in a plate-fin heat exchanger with interfin core channels of trapezoidal cross section and by extension, its limiting rectangular and triangular cross ...

Abstract: The fin effects on laminar forced convection of air in the interfin passages of plate-fin heat exchangers are investigated. Steady state fully developed flows in rectangular, trapezoidal, and ...

Abstract: Ball formation is the first step in wire bonding of semiconductor chips to their lead frames. An electric discharge melts the wire and surface tension causes the melt to roll up into a ball; ...

Abstract: The pressure swirl atomizer, or simplex atomizer, is widely used in liquid fuel combustion devices in the aerospace and power generation industries. A computational, experimental, and theoretical ...