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    Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 004:;page 512
    Author(s): C. J. Liu; G. Q. Zhang; M. Vervoort; L. J. Ernst; G. Wisse
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in ...
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