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    Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode 

    Source: Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004:;page 41003
    Author(s): Yan, Yi; Guan, Youliang; Chen, Xu; Lu, Guo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The thermal and the optoelectronic performance of high power gallium arsenide (GaAs) laser diode dieattached with sintered silver joint were investigated. The thermal and mechanical characteristics of the Laser bar packaging ...
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    Bubble Effects on Manufacturing of Silicon Nanowires by Metal-Assisted Chemical Etching 

    Source: Journal of Manufacturing Science and Engineering:;2023:;volume( 145 ):;issue: 009:;page 94501-1
    Author(s): Lee, Pee-Yew; Weng, Chun-Jen; Huang, Hung Ji; Wu, Li-Yan; Lu, Guo-Hao; Liu, Chao-Feng; Chen, Cheng-You; Li, Ting-Yu; Lin, Yung-Sheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Micro/nano-textured Si wafers manufactured using metal-assisted chemical etching (MACE) have been the focus of several studies, but the mechanism of bubble generation during the MACE process affecting textured surfaces has ...
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    Hyperspectral Analysis of Silicon Nanowires Manufactured Through Metal-Assisted Chemical Etching 

    Source: Journal of Manufacturing Science and Engineering:;2024:;volume( 147 ):;issue: 002:;page 24501-1
    Author(s): Lee, Pee-Yew; Lu, Guo-Hao; Bai, Yi-Hong; Chen, Cheng-You; Wu, Li-Yan; Weng, Chun-Jen; Huang, Hung Ji; Lin, Yung-Sheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study used hyperspectral imaging to analyze localized near-field interactions between incident electromagnetic waves and silicon nanowire (SiNW) arrays manufactured through catalytic etching of Si wafers for different ...
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    Dropwindsonde Observations for Typhoon Surveillance near the Taiwan Region (DOTSTAR): An Overview 

    Source: Bulletin of the American Meteorological Society:;2005:;volume( 086 ):;issue: 006:;page 787
    Author(s): Wu, Chun-Chieh; Lin, Po-Hsiung; Aberson, Sim; Yeh, Tien-Chiang; Huang, Wei-Peng; Chou, Kun-Hsuan; Hong, Jing-Shan; Lu, Guo-Chen; Fong, Chin-Tzu; Hsu, Kuan-Chien; Lin, I-I.; Lin, Pay-Liam; Liu, Ching-Hwang
    Publisher: American Meteorological Society
    Abstract: No Abstract Available.
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