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    Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003:;page 177
    Author(s): Liu Caroline Chen; Zonghe Lai; Zhaonian Cheng; Johan Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we ...
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