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RISComparative Study of Thermal Performance of Longitudinal and Transversal Wavy Microchannel Heat Sinks for Electronic Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Liquid cooling incorporating microchannels are used to cool electronic chips in order to remove more heat load. However, such microchannels are often designed to be straight with rectangular cross section. In this paper, ...
Computational Study and Optimization of Laminar Heat Transfer and Pressure Loss of Double Layer Microchannels for Chip Liquid Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The problem involved in the increase of the chip output power of highperformance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to be ...