Abstract: Motivated by the interest to increase production throughputs of immersion lithography machines, wafers are scanned at increasingly high velocities and accelerations, which may result in liquid loss at the receding contact ...

Abstract: For the first time, finite element analysis (FEA) is applied to the thermal-compression flip-chip process in micro-electronics. By adding the bump height nonuniformity and the morphology variance, a common basal line is ...