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Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal ground planes (TGPs) are passive thermal management devices that utilize the phase-change of a working fluid to achieve high thermal conductivity and low thermal resistance. TGPs are flat, two-dimensional heat ...
Elastic–Plastic Properties of Mesoscale Electrodeposited LIGA Nickel Alloy Films: Analysis of Measurement Uncertainties
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: It is well documented that the microstructure and properties of electrodeposited films, such as lithographie, galvanoformung, abformung (LIGA) Ni and its alloys, are highly sensitive to processing conditions hence the ...