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RISEffects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Nonconductive film (NCF) is a challenging potential material to substitute the application of anisotropic conductive film in the ultrafine pitch chip-on-glass (COG) packaging. The NCF interconnection ...