Abstract: The present study presents a concept of biporous metal foam heat sink applicable to electronic cooling. This heat sink has two metal foam layers arranged in parallel along the primary flow direction, with different metal ...

Abstract: The present study presents a concept of biporous metal foam heat sink applicable to electronic cooling. This heat sink has two metal foam layers arranged in parallel along the primary flow direction, with different metal ...

Abstract: High porosity metal foams offer large surface area per unit volume and have been considered as effective candidates for convection heat transfer enhancement, with applications as heat sinks in electronics cooling. In this ...