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    An Eccentric Ellipse Failure Criterion for Amorphous Materials 

    Source: Journal of Applied Mechanics:;2017:;volume( 084 ):;issue: 008:;page 81005
    Author(s): Ding, Bin; Li, Xiaoyan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We proposed an eccentric ellipse criterion to describe the failure of amorphous materials under a combination of normal stress σ and shear stress τ. This criterion can reflect a tension–compression strength asymmetry, and ...
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    Scaling Effect of Dry Adhesion for Microfibrils and Transition Size to Flaw Insensitivity 

    Source: Journal of Applied Mechanics:;2023:;volume( 090 ):;issue: 012:;page 121008-1
    Author(s): Zhang, Xuan; Li, Xiaoyan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The mechanics of detachment (e.g., a cylindrical fibril separating from a dissimilar substrate) has been treated in the perspectives of contact mechanics and fracture mechanics theory along with numerical simulations, but ...
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    Study on the Influential Factors in and the Optimization of Asphalt Mixture Scanning with X-Ray CT Technology 

    Source: Journal of Highway and Transportation Research and Development (English Edition):;2015:;Volume ( 009 ):;issue: 003
    Author(s): Wang Hai-nian; Liu Yang; Bu Yin; Zhou Yang; Li Xiao-yan
    Publisher: American Society of Civil Engineers
    Abstract: The effects of sample size, aggregate lithology, and compaction pattern on image scanning quality were determined using 225 kV industrial computer tomography equipment. Moreover, the scanning parameters of common Marshall ...
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    Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging 

    Source: Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 003:;page 31001-1
    Author(s): Yang, Gangli; Li, Xiaoyan; Han, Xu; Zhang, Hu; Wen, Linjie; Li, Shanshan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The paper focused on the changes in microstructure and mechanical properties of the full Cu41Sn11 solder joint (Cu/Cu41Sn11/Cu) during isothermal aging at 420 °C. It was motivated by potential applications of Cu–Sn ...
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