Abstract: Free abrasive diamond wire saw machining is often used to cut hard and brittle materials, especially for wafers in the semiconductor and optoelectronics industries. Wire saws, both free and fixed abrasive, have excellent ...

Abstract: Wire saws with fixed diamond abrasive are often used to cut hard and brittle materials owning to the wire saw's narrow kerf, low cutting force, and minimal material waste. Typically, the cutting force changes during the ...