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RISThermal Resistance Analysis of Sn Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: To promote heat dissipation in power electronics, we investigated the thermal conduction performance of SnBi solder paste between two Cu plates. We measured the thermal resistance of SnBi solder paste used as thermal ...
Interdecadal Variations of Different Types of Summer Heat Waves in Northeast China Associated with AMO and PDO
Publisher: American Meteorological Society