Abstract: The monthly wind stress over the global ocean has been calculated using updated climatological monthly mean wind data. The effect of the variablility of the wind has been incorporated by using the wind speed frequency ...

Abstract: Repeated loading is an important reason to cause pad cratering fatigue failure in ball grid array (BGA) device in printed circuit board (PCB) assembly. For industry application, the board level drop test is commonly applied ...

Abstract: SnCuNi is one of the most common ternary intermetallic compounds formed in the Snbased solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial ...

Abstract: Conventional reliability tests for the evaluation of pad cratering resistance are mainly classified into two categories: the board level test and the joint level test. The board-level test is to imitate the loading conditions ...

Abstract: Cu pillar microbumps with polymer cores have been demonstrated to effectively reduce thermomechanical stress and improve joint reliability. Fabricating polymer cores by a printing approach was proposed to overcome the ...

Abstract: In recent years, due to the increased size of ball grid array (BGA) devices, the assembly of BGAs on printed circuit boards through surface mount technology has encountered unprecedented challenges from thermal warpage. ...