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RISInvestigation of Impact Profile and Isolation Effect in Automated Impact Device Design and Control for Operational Modal Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel modal analysis technique called impactsynchronous modal analysis (ISMA) was introduced in previous research. With the utilization of impactsynchronous time averaging (ISTA), this modal analysis can be performed in ...
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Effects of Ag content (0 ∼ 3 wt%) in Sn-xAgCu0.7 solders on microstructure characteristics and low cycling fatigue at different temperature conditions are overall investigated. To increase Ag content, the solidus points ...