Abstract: This paper discusses the current reliability issues involved with typical postmolded IC packages. Four major topics are presented, namely, stress, moisture permeation and corrosion-related problems, ...

Abstract: This paper describes mechanical means for enhancing the adhesion between the epoxy molding compound and the die and die pad in plastic packages. By introducing patterns of holes and slots along ...

Abstract: This paper examines the effects of device and leadframe configurations on the stresses encountered in typical Dual-in-Line plastic packages. The parameters studied include the die size, the die ...