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    Thermal Enhancement Coatings for Microelectronic Systems 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003:;page 229
    Author(s): L. S. Fletcher; M. A. Lambert; E. E. Marotta
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The power densities and heat generation in microelectronic systems have increased dramatically as individual electronic components have been miniaturized. As a result of the growing number of ...
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    The Effect of Nonuniform Interfacial Pressures on the Heat Transfer in Bolted and Riveted Joints 

    Source: Journal of Energy Resources Technology:;1990:;volume( 112 ):;issue: 003:;page 174
    Author(s): C. V. Madhusudana; G. P. Peterson; L. S. Fletcher
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In bolted or riveted joints where the interfacial pressure is not uniform, the total resistance to heat flow in a vacuum is the result of two separate components: the microscopic resistance, ...
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    Thermal Modeling of a Multilayer Insulation System 

    Source: Journal of Heat Transfer:;2010:;volume( 132 ):;issue: 009:;page 91303
    Author(s): D. K. Kim; L. S. Fletcher; E. E. Marotta
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An analytical investigation of a novel multilayer insulation concept was conducted using an extended analytical model. This model was developed to accommodate a multilayer screen wire insulation ...
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