Abstract: As electronic packaging technology moving to the CSP, wafer level packaging, fine pitch BGA (ball grid array) and high density interconnections, the wireability of the PCB/substrate and soldering ...

Abstract: This study presents an efficient method to accurately predict solder joint geometry after a reflow process. The proposed method can be utilized for Solder Mask Defined (SMD), Non-Solder Mask ...

Abstract: An accurate and efficient analytical geometric method is presented for predicting the geometric parameters of the controlled collapse chip connection type solder joint using direct chip attach ...