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RISAn Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Although accelerated thermal cycling has been widely used in electronics industry to qualify electronic packages, efforts to reduce the time and cost associated with such qualification techniques ...
Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A field-use induced damage mapping methodology is presented that can take into consideration the field-use thermal environment profile to develop accelerated thermal cycling guidelines for packages ...