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RISA Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the authors present a stress analysis technique based on a novel nested finite element methodology (NFEM). The NFEM is similar in concept to an earlier proposed multi-domain ...
A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The nested finite element methodology (NFEM) presented in Part I of this series, is used in this paper to analyze the viscoplastic stress-state in a flip-chip-on-board (FCOB) and a chip scale ...