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RISOptimized Design and Simulation Study of Liquid-Cooled Heat Sink Model for IGBT Module Based on TPMS Structure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this article, we propose a liquid-cooled heat sink model utilizing a triple periodic minimal surface (TPMS) structure for insulated gate bipolar transistor (IGBT) modules. By using parametric modeling software ntopology, ...