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    Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004:;page 385
    Author(s): Ki-Ju Kang; Tae-Sung Bae; Seon-Ho Choi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high ...
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    Effect of Geometry and Materials on Residual Stress Measurement in Thin Films by Using the Focused Ion Beam 

    Source: Journal of Engineering Materials and Technology:;2004:;volume( 126 ):;issue: 004:;page 457
    Author(s): Ki-Ju Kang; Severine Darzens; Gee-Seob Choi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Recently, a new method for residual stress measurement in thin films by using the focused ion beam (FIB) has been proposed by the authors. It is based on the combined capability of the FIB ...
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