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    A Model for Capturing Product Assembly Information 

    Source: Journal of Computing and Information Science in Engineering:;2006:;volume( 006 ):;issue: 001:;page 11
    Author(s): Sebti Foufou; Shaw C. Feng; Utpal Roy; Fujun Wang; Sudarsan Rachuri; Young-Hyun Han; Ram D. Sriram; Kevin W. Lyons
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The important issue of mechanical assemblies has been a subject of intense research over the past several years. Most electromechanical products are assemblies of several components, for various ...
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    DSpace software copyright © 2002-2015  DuraSpace
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